Henkel Introduces Low Volatile Silicone-based Gap Filler for Auto Electronics

Henkel’s BERGQUIST Gap Filler TGF 2900 LVO is a 2-component, low volatile silicone-based gap filler for automotive electronic components – offering high performance and fast processing.

Henkel

July 24, 2023

2 Min Read
1540 x 800 – UPDATEDno text_v3

Automotive electronics manufacturers continue to contend with ever-changing market needs. From the trend toward miniaturization and increased operating temperatures to the need to meet growing demand, the pressure to produce high-performing electronic components quickly and efficiently has never been greater.

When paired with optimal dispense equipment, BERGQUIST Gap Filler TGF 2900 LVO can deliver on everything from high performance and reliability to fast dispense and efficient assembly – offering a total solutions package that meets the needs of today’s challenging environment.

Henkel Launches BERGQUIST Gap Filler TGF 2900 LVO

Available for application across a variety of automotive electronic components, including control units, ADAS data modules, sensors, actuators and more, Henkel’s BERGQUIST Gap Filler TGF 2900 LVO is a 2-component, low volatile silicone-based gap filler – controlling volatile outgassing silicones for sensitive electronic applications. The technology offers extended working time, high performance & fast processing under severe thermal load – delivering on today’s complex manufacturing needs.

Extended Working Time

Working time is important to provide increased flexibility in dispensing and assembly. Henkel BERGQUIST Gap Filler TGF 2900 LVO provides 120 minutes of working time, curing in approximately 12 hours at room temperature. As a result of this increased processing window, scrap is reduced, improving sustainability and reducing cost.

High Performance

Formulated for thin bond line thickness of <50 µm, Henkel BERGQUIST Gap Filler TGF 2900 LVO lowers overall thermal resistance and provides medium thermal conductivity at 2.9 W/m-K. Additional performance benefits include higher elastic behavior combined with improved adhesive strength (pull-out strength) for improved gap stability. Outstanding slump resistance of 0.05 helps ensure no self-leveling during dispense.

Pull-out Force-100.jpg

Pull-out Force-100

Fast Processing

Henkel BERGQUIST Gap Filler TGF 2900 LVO offers excellent dispensing properties for automated equipment – enabling easy, fast dispensing with hot shot consistency for high throughput manufacturing. Additionally, the product’s low abrasion level helps extend equipment life and reduce maintenance expenses. For more information on Henkel’s BERGQUIST TGF 2900 LVO, please contact us here or reach out to our Business Development Manager, Laura Ueberbacher, at [email protected]

You May Also Like