Integrated Circuit Reduces Power Management Complexity

DETROIT – AMI Semiconductor (AMIS) says it can reduce the need for other power-management components by providing a medium-current single chip that does it all.

The integrated mixed-signal specialist is launching the AMIS-70050, an “octal high-side driver” integrated circuit it claims will drive virtually any load in microcontroller-based automotive and industrial control applications.

This chip solution is applied to the interface between a 3.3 volt-5.0 volt host microcontroller and any physical load, such as low-emitting diodes, without additional circuitry.

The supplier uses the Convergence conference here to present the AMIS-70050 as ideal for automotive load management and dashboard applications, as well as other designs where various functions are controlled by a microcontroller.

AMI says the interface allows more control and diagnostic information to be passed between the microcontroller and AMIS-70050, compared with standard parallel interface used in most parts.

The AMIS-70050 is priced at $1.99 per unit for quantities in excess of 5,000 pieces.

Meanwhile, the supplier announces its AMIS-30660 high-speed controller area network (CAN) transceiver integrated circuit will be used by AutoXray, a leading provider of automotive diagnostic equipment.

The network provides the interface between a CAN controller and the physical bus, allowing designers to reduce the number of components.

AutoXray, which provides battery-powered diagnostic tools for technicians, appreciates the low standby current of the AMIS-30660, providing a longer cycle time between battery charges.

“We tested it with a wide range of vehicles, including heavy-duty trucks and feel that it’s a great fit,” says Jay Seashore, AutoXray chief technical officer.

Headquartered in Pocatello, ID, AMI Semiconductor is a global leader in the design and manufacture of silicon solutions.

Its automotive capabilities include electronic stability programs; occupant classification systems, such as smart airbags and smart seats; bending and leveling headlamps; light-emitting diodes, rear-light cluster; in-vehicle networking; dashboard applications and wireless capabilities for tire-pressure testing and keyless entry.

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